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FDMS008G-CAK Tech Specifications

Category Memory
Manufacturer FLEx
Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 9Terminals
Package Style UNCASED CHIP
Number of Words Code 8G
Package Body Material UNSPECIFIED
Operating Temperature-Min -40
Operating Temperature-Max 85
Number of Words 8589934592Words
Package Code DIE
Package Shape RECTANGULAR
Package Description CARD-9
Manufacturer Part Number FDMS008G-CAK
Manufacturer Flexxon Pte Ltd
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer FLEXXON GLOBAL LTD
Risk Rank 5.77
Operating Temperature -65°C ~ 175°C
Series Military, MIL-PRF-22684/02, RL20
Packaging Bulk
Size / Dimension 0.145 Dia x 0.375 L (3.68mm x 9.53mm)
Tolerance ±5%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±200ppm/°C
Type NOR TYPE
Resistance 7.5 kOhms
Composition Metal Film
Power (Watts) 0.5W, 1/2W
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-XUUC-N9
Failure Rate --
Supply Voltage-Max (Vsup) 3.6
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 8GX8
Memory Width 8
Memory Density 68719476736
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Programming Voltage 2.7
Features Flame Retardant Coating, Military, Moisture Resistant, Safety
Height Seated (Max) --
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