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FDMS512M-C0C Tech Specifications

Category Memory
Manufacturer FLEx
Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 9Terminals
Package Style UNCASED CHIP
Number of Words Code 512M
Package Body Material UNSPECIFIED
Operating Temperature-Min 0
Operating Temperature-Max 70
Number of Words 536870912Words
Package Code DIE
Package Shape RECTANGULAR
Manufacturer Flexxon Pte Ltd
Manufacturer Part Number FDMS512M-C0C
Package Description CARD-9
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer FLEXXON GLOBAL LTD
Risk Rank 5.79
Operating Temperature -65°C ~ 175°C
Series Military, MIL-PRF-55182/01, RNC55
Packaging Bulk
Size / Dimension 0.094 Dia x 0.250 L (2.39mm x 6.35mm)
Tolerance ±0.1%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±50ppm/°C
Type NOR TYPE
Resistance 76.8 Ohms
Composition Metal Film
Power (Watts) 0.125W, 1/8W
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-XUUC-N9
Failure Rate S (0.001%)
Supply Voltage-Max (Vsup) 3.6
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 512MX8
Memory Width 8
Memory Density 4294967296
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Programming Voltage 2.7
Features Military, Moisture Resistant, Weldable
Height Seated (Max) --
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