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XCB56007FJ50 Tech Specifications

Category Embedded - DSP (Digital Signal Processors)
Manufacturer Freescale
Surface Mount YES
Number of Terminals 80Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description QFP, QFP80,.7SQ
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP80,.7SQ
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Nom 5 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Reach Compliance Code unknown
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Power Supplies 5 V
Supply Current-Max 105 mA
Bit Size 24
Format FIXED-POINT
RAM (words) 3200
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XCB56007FJ50 Documents

Download datasheets and manufacturer documentation for   XCB56007FJ50

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