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XPC850DSLZT50BU Tech Specifications

Category Embedded - Microprocessors
Manufacturer Freescale
Package / Case BGA
Surface Mount YES
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish TIN LEAD
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 3.3V
Frequency 50MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Halogen Free Not Halogen Free
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Number of Cores 1Core
Length 23mm
Height Seated (Max) 2.35mm
Width 23mm
RoHS Status RoHS Compliant
Lead Free Contains Lead
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XPC850DSLZT50BU Documents

Download datasheets and manufacturer documentation for   XPC850DSLZT50BU

XPC850DSLZT50BU brand manufacturers: Freescale Semiconductor, Inc. (NXP Semiconductors), Elecinsight stock, XPC850DSLZT50BU reference price.Freescale Semiconductor, Inc. (NXP Semiconductors). XPC850DSLZT50BU parameters, XPC850DSLZT50BU Datasheet PDF and pin diagram description download.You can use the XPC850DSLZT50BU Embedded - Microprocessors, DSP Datesheet PDF, find XPC850DSLZT50BU pin diagram and circuit diagram and usage method of function,XPC850DSLZT50BU electronics tutorials.You can download from the Elecinsight.