DLP-FPGA Tech Specifications

Category Embedded - Microcontroller, Microprocessor, FPGA Modules
Manufacturer FTDI
Body Material Polyolefin
Product Thickness 0.64
Operating Temp Range -55C to 135C
Shrink Wall Type SINGLE
Inside Diameter After Shrinking 3.2
Inside Diameter Before Shrinking 6.4
Package Bulk
Mfr FTDI, Future Technology Devices International Ltd
Product Status Active
Factory Pack QuantityFactory Pack Quantity 1
Manufacturer FTDI
Brand FTDI
RoHS Details
Operating Temperature -
Series FPGA
Packaging Bulk
Size / Dimension -
Connector Type USB - B, Pin Header
Type TUBING
Color Clear
Subcategory Development Tools
Speed -
RAM Size 128KB
Core Processor Spartan-3E, XC3S250E
Product Type Interface Development Tools
Module/Board Type FPGA Core
Flash Size -
Co-Processor -
Product Category Interface Development Tools
Shrink Ratio 2:1
Product Length (mm) 1200(mm)
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