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- DLP-FPGA
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DLP-FPGA Tech Specifications
| Category | Embedded - Microcontroller, Microprocessor, FPGA Modules | |
| Manufacturer | FTDI | |
| Body Material | Polyolefin | |
| Product Thickness | 0.64 | |
| Operating Temp Range | -55C to 135C | |
| Shrink Wall Type | SINGLE | |
| Inside Diameter After Shrinking | 3.2 | |
| Inside Diameter Before Shrinking | 6.4 | |
| Package | Bulk | |
| Mfr | FTDI, Future Technology Devices International Ltd | |
| Product Status | Active | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | FTDI | |
| Brand | FTDI | |
| RoHS | Details | |
| Operating Temperature | - | |
| Series | FPGA |
| Packaging | Bulk | |
| Size / Dimension | - | |
| Connector Type | USB - B, Pin Header | |
| Type | TUBING | |
| Color | Clear | |
| Subcategory | Development Tools | |
| Speed | - | |
| RAM Size | 128KB | |
| Core Processor | Spartan-3E, XC3S250E | |
| Product Type | Interface Development Tools | |
| Module/Board Type | FPGA Core | |
| Flash Size | - | |
| Co-Processor | - | |
| Product Category | Interface Development Tools | |
| Shrink Ratio | 2:1 | |
| Product Length (mm) | 1200(mm) |
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