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- MB89R118C2-DIAP15-P1
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MB89R118C2-DIAP15-P1 Tech Specifications
| Category | Specialized ICs | |
| Manufacturer | Fujitsu | |
| Surface Mount | YES | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | DIE, | |
| Number of Words | 2048 wordsWord | |
| Number of Words Code | 2000Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | UNSPECIFIED |
| Package Style | UNCASED CHIP | |
| Additional Feature | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | UPPER | |
| Terminal Form | NO LEAD | |
| Number of Functions | 1Function | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | X-XUUC-N | |
| Organization | 2KX8 | |
| Memory Width | 8 | |
| Memory Density | 16384 bit | |
| Memory IC Type | FRAM-EMBEDDED | |
| Endurance | 1000000000000 Write/Erase Cycles | |
| Data Retention Time-Min | 10 |
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MB89R118C2-DIAP15-P1 Documents
Download datasheets and manufacturer documentation for MB89R118C2-DIAP15-P1
- DatasheetsFJSU-S-A0008112548-1.pdf
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