MB89R118C2-DIAP15-P1 Tech Specifications

Category Specialized ICs
Manufacturer Fujitsu
Surface Mount YES
Part Life Cycle Code Active
Ihs Manufacturer FUJITSU LTD
Package Description DIE,
Number of Words 2048 wordsWord
Number of Words Code 2000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Package Body Material UNSPECIFIED
Package Code DIE
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED
Package Style UNCASED CHIP
Additional Feature DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
HTS Code 8542.39.00.01
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code X-XUUC-N
Organization 2KX8
Memory Width 8
Memory Density 16384 bit
Memory IC Type FRAM-EMBEDDED
Endurance 1000000000000 Write/Erase Cycles
Data Retention Time-Min 10
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MB89R118C2-DIAP15-P1 Documents

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