FST100200 Tech Specifications

Category Diodes - Rectifiers - Arrays
Manufacturer GeneSiC Semiconductor
Lifecycle Status PRODUCTION (Last Updated: 5 months ago)
Factory Lead Time 6 Weeks
Mount Chassis Mount
Mounting Type Chassis Mount
Package / Case TO-249AB
Diode Element Material SILICON
Number of Elements 2 Elements
Operating Temperature (Max.) 150°C
Packaging Bulk
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Applications POWER
HTS Code 8541.10.00.80
Terminal Position SINGLE
Terminal Form SOLDER LUG
JESD-30 Code R-PSFM-D3
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 1mA @ 200V
Voltage - Forward (Vf) (Max) @ If 920mV @ 50A
Case Connection ISOLATED
Operating Temperature - Junction -55°C~150°C
Max Reverse Voltage (DC) 200V
Average Rectified Current 50A
Number of Phases 1Phase
Non-rep Pk Forward Current-Max 1000A
Diode Configuration 1 Pair Common Cathode
Reverse Current-Max 1000μA
RoHS Status RoHS Compliant
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