FST10080 Tech Specifications

Category Diodes - Rectifiers - Arrays
Manufacturer GeneSiC Semiconductor
Lifecycle Status PRODUCTION (Last Updated: 6 months ago)
Factory Lead Time 6 Weeks
Mount Chassis Mount
Mounting Type Chassis Mount
Package / Case TO-249AB
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Bulk
Published 2010
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Max Operating Temperature 125°C
Min Operating Temperature -40°C
Applications POWER
Terminal Position SINGLE
Terminal Form SOLDER LUG
JESD-30 Code R-PSFM-D3
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 2mA @ 20V
Voltage - Forward (Vf) (Max) @ If 840mV @ 100A
Case Connection ISOLATED
Forward Current 100A
Max Reverse Leakage Current 1μA
Operating Temperature - Junction -55°C~150°C
Max Surge Current 1kA
Output Current-Max 50A
Max Reverse Voltage (DC) 80V
Average Rectified Current 100A
Number of Phases 1Phase
Peak Reverse Current 1A
Max Repetitive Reverse Voltage (Vrrm) 80V
Diode Configuration 1 Pair Common Cathode
RoHS Status RoHS Compliant
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