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GD5F2GQ4RBYIG Tech Specifications

Category Memory - Modules
Manufacturer GigaDevice
Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer GIGADEVICE SEMICONDUCTOR INC
Package Description HSON,
Clock Frequency-Max (fCLK) 120 MHz
Number of Words 536870912 wordsWord
Number of Words Code 512000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
Additional Feature IT ALSO HAVE MEMORY WIDTH X1
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-N8
Supply Voltage-Max (Vsup) 2 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Organization 512MX4
Memory Width 4
Memory Density 2147483648 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 1.8 V
Alternate Memory Width 2
Length 8 mm
Width 6 mm
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GD5F2GQ4RBYIG Documents

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