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GD25LQ64CSIGR Tech Specifications

Category Memory
Manufacturer GigaDevice
Factory Lead Time 4 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Voltage - Supply 1.65V~2V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G8
Supply Voltage-Max (Vsup) 2V
Supply Voltage-Min (Vsup) 1.65V
Memory Size 64Mb 8M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 120MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 64MX1
Memory Width 1
Write Cycle Time - Word, Page 2.4ms
Memory Density 67108864 bit
Parallel/Serial SERIAL
Programming Voltage 1.8V
Length 5.28mm
Height Seated (Max) 2.16mm
Width 5.23mm
RoHS Status ROHS3 Compliant
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GD25LQ64CSIGR Documents

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