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GS8161E36DGD-400 Tech Specifications

Category Memory
Manufacturer GSI
Package / Case BGA-165
Maximum Clock Rate 250@Flow-Through/400@Pipelined MHz
Supplier Package FBGA
Data Rate Architecture SDR
Typical Operating Supply Voltage 2.5, 3.3 V
Minimum Operating Supply Voltage 2.3, 3 V
Timing Type Synchronous
Number of Words 512 kWordsWord
Number of I/O Lines 36 BitI/O Line
Maximum Operating Supply Voltage 2.7, 3.6 V
Mounting Surface Mount
Moisture Sensitive Yes
Maximum Clock Frequency 400 MHz
Maximum Operating Temperature + 70 C
Supply Voltage-Max 3.6 V
Minimum Operating Temperature 0 C
Factory Pack QuantityFactory Pack Quantity 36
Supply Voltage-Min 2.3 V
Mounting Styles SMD/SMT
Interface Type Parallel
Manufacturer GSI Technology
Brand GSI Technology
Tradename SyncBurst
RoHS Details
Memory Types SDR
Usage Level Commercial grade
Operating Temperature 0 to 70 °C
Series GS8161E36DGD
Packaging Tray
Type DCD Pipeline/Flow Through
Subcategory Memory & Data Storage
Pin Count 165
Memory Size 18 Mbit
Number of Ports 4Ports
Supply Current-Max 280 mA, 365 mA
Access Time 4 ns
Architecture Flow-Through/Pipelined
Organization 512 k x 36
Address Bus Width 19 Bit
Product Type SRAM
Density 18 Mbit
Screening Level Commercial
Product Category SRAM
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