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GS8662Q10BGD-333 Tech Specifications

Category Memory
Manufacturer GSI
Factory Lead Time 8 Weeks
Package / Case BGA-165
Surface Mount YES
Number of Terminals 165Terminals
Maximum Clock Rate 333 MHz
Supplier Package FBGA
Data Rate Architecture QDR
Typical Operating Supply Voltage 1.8000 V
Minimum Operating Supply Voltage 1.7 V
Timing Type Synchronous
Number of Words 8 MWordsWord
Number of I/O Lines 9 BitI/O Line
Maximum Operating Supply Voltage 1.9 V
Mounting Surface Mount
Maximum Clock Frequency 333 MHz
Maximum Operating Temperature + 70 C
Supply Voltage-Max 1.9 V
Minimum Operating Temperature 0 C
Supply Voltage-Min 1.7 V
Mounting Styles SMD/SMT
Interface Type Parallel
Package Description LBGA, BGA165,11X15,40
Package Style GRID ARRAY, LOW PROFILE
Moisture Sensitivity Levels 3
Number of Words Code 8000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA165,11X15,40
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 0.45 ns
Operating Temperature-Max 70 °C
Rohs Code Yes
Manufacturer Part Number GS8662Q10BGD-333
Clock Frequency-Max (fCLK) 333 MHz
Supply Voltage-Nom (Vsup) 1.8 V
Package Code LBGA
Package Shape RECTANGULAR
Manufacturer GSI Technology
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Risk Rank 1.92
Part Package Code BGA
Usage Level Commercial grade
Operating Temperature 0 to 85 °C
Series GS8662Q10BGD
JESD-609 Code e1
Pbfree Code Yes
ECCN Code 3A991.B.2.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 165
JESD-30 Code R-PBGA-B165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Power Supplies 1.5/1.8,1.8 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 1.7 V
Memory Size 72 Mbit
Number of Ports 2Ports
Operating Mode SYNCHRONOUS
Supply Current-Max 920 mA
Architecture Pipelined
Organization 8 M x 9
Output Characteristics 3-STATE
Seated Height-Max 1.4 mm
Memory Width 9
Address Bus Width 22 Bit
Density 72 Mbit
Standby Current-Max 0.27 A
Memory Density 75497472 bit
Screening Level Commercial
Parallel/Serial PARALLEL
I/O Type SEPARATE
Memory IC Type DDR SRAM
Standby Voltage-Min 1.7 V
Width 13 mm
Length 15 mm
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