GS881E18CGD-200V Tech Specifications

Category Memory
Manufacturer GSI
Package / Case BGA-165
Maximum Clock Rate 153.8@Flow-Through/200@Pipelined MHz
Supplier Package FBGA
Data Rate Architecture SDR
Typical Operating Supply Voltage 1.8, 2.5 V
Minimum Operating Supply Voltage 1.7, 2.3 V
Timing Type Synchronous
Number of Words 512 kWordsWord
Number of I/O Lines 18 BitI/O Line
Maximum Operating Supply Voltage 2, 2.7 V
Mounting Surface Mount
Moisture Sensitive Yes
Maximum Clock Frequency 200 MHz
Maximum Operating Temperature + 70 C
Supply Voltage-Max 2.7 V
Minimum Operating Temperature 0 C
Factory Pack QuantityFactory Pack Quantity 66
Supply Voltage-Min 1.7 V
Mounting Styles SMD/SMT
Interface Type Parallel
Manufacturer GSI Technology
Brand GSI Technology
Tradename SyncBurst
RoHS Details
Memory Types SDR
Usage Level Commercial grade
Operating Temperature 0 to 70 °C
Series GS881E18CGD
Packaging Tray
Type DCD Pipeline/Flow Through
Subcategory Memory & Data Storage
Pin Count 165
Memory Size 9 Mbit
Number of Ports 2Ports
Supply Current-Max 115 mA, 140 mA
Access Time 6.5 ns
Architecture Flow-Through/Pipelined
Organization 512 k x 18
Address Bus Width 18 Bit
Product Type SRAM
Density 9 Mbit
Screening Level Commercial
Product Category SRAM
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