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- GS881Z36CGD-200V
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GS881Z36CGD-200V Tech Specifications
Category | Memory | |
Manufacturer | GSI | |
Factory Lead Time | 8 Weeks | |
Package / Case | BGA-165 | |
Surface Mount | YES | |
Number of Terminals | 165Terminals | |
Maximum Clock Rate | 153.8@Flow-Through/200@Pipelined MHz | |
Supplier Package | FBGA | |
Typical Operating Supply Voltage | 1.8, 2.5 V | |
Minimum Operating Supply Voltage | 1.7, 2.3 V | |
Number of I/O Lines | 36 BitI/O Line | |
Maximum Operating Supply Voltage | 2, 2.7 V | |
Moisture Sensitive | Yes | |
Maximum Clock Frequency | 200 MHz | |
Maximum Operating Temperature | + 70 C | |
Supply Voltage-Max | 2.7 V | |
Minimum Operating Temperature | 0 C | |
Factory Pack QuantityFactory Pack Quantity | 66 | |
Supply Voltage-Min | 1.7 V | |
Mounting Styles | SMD/SMT | |
Interface Type | Parallel | |
Manufacturer | GSI Technology | |
Brand | GSI Technology | |
Tradename | NBT SRAM | |
RoHS | Details | |
Memory Types | SDR | |
Package Description | LBGA, | |
Package Style | GRID ARRAY, LOW PROFILE | |
Moisture Sensitivity Levels | 3 | |
Number of Words Code | 256000Words Codes | |
Package Body Material | PLASTIC/EPOXY | |
Reflow Temperature-Max (s) | NOT SPECIFIED | |
Access Time-Max | 6.5 ns | |
Operating Temperature-Max | 70 °C | |
Rohs Code | Yes | |
Manufacturer Part Number | GS881Z36CGD-200V | |
Number of Words | 262144 wordsWord | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY |
Risk Rank | 5.14 | |
Part Package Code | BGA | |
Usage Level | Commercial grade | |
Operating Temperature | 0 to 70 °C | |
Series | GS881Z36CGD | |
Packaging | Tray | |
JESD-609 Code | e1 | |
Pbfree Code | Yes | |
ECCN Code | 3A991.B.2.B | |
Type | NBT | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Additional Feature | IT ALSO OPERATE WITH 2.5 V, FLOW THROUGH AND PIPELINED ARCHITECTURE | |
HTS Code | 8542.32.00.41 | |
Subcategory | Memory & Data Storage | |
Technology | CMOS | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Terminal Pitch | 1 mm | |
Reach Compliance Code | compliant | |
Pin Count | 165 | |
JESD-30 Code | R-PBGA-B165 | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 2 V | |
Temperature Grade | COMMERCIAL | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Memory Size | 9 Mbit | |
Operating Mode | SYNCHRONOUS | |
Supply Current-Max | 125 mA, 150 mA | |
Access Time | 6.5@Flow-Through/3@P | |
Organization | 256 k x 36 | |
Seated Height-Max | 1.4 mm | |
Memory Width | 36 | |
Product Type | SRAM | |
Memory Density | 9 | |
Screening Level | Commercial | |
Parallel/Serial | PARALLEL | |
Memory IC Type | ZBT SRAM | |
Product Category | SRAM | |
Width | 13 mm | |
Length | 15 mm |
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