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- HC1-55564-8
Harris Semiconductor HC1-55564-8 Telecom Interface ICs
DUAL
IN STOCK
Min. : 1
Mult. : 1
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HC1-55564-8 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | HARRIS | |
| Surface Mount | NO | |
| Number of Terminals | 14Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | HARRIS SEMICONDUCTOR | |
| Package Description | DIP, DIP14,.3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP14,.3 | |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XDIP-T14 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | MILITARY | |
| Screening Level | 38535Q/M;38534H;883B |
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