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- HM1-7611-2
Harris Semiconductor HM1-7611-2 Memory Modules
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HM1-7611-2 Tech Specifications
| Category | Memory - Modules | |
| Manufacturer | HARRIS | |
| Surface Mount | NO | |
| Number of Terminals | 16Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | HARRIS SEMICONDUCTOR | |
| Package Description | DIP, DIP16,.3 | |
| Access Time-Max | 75 ns | |
| Number of Words | 256 wordsWord | |
| Number of Words Code | 256Words Codes | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE |
| Supply Voltage-Nom (Vsup) | 5 V | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.32.00.71 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XDIP-T16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | MILITARY | |
| Supply Current-Max | 0.13 mA | |
| Organization | 256X4 | |
| Memory Width | 4 | |
| Memory Density | 1024 bit | |
| Memory IC Type | OTP ROM |
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