Harris Semiconductor MD82C52 Application Specific MCUs
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MD82C52 Tech Specifications
| Category | Embedded - Microcontrollers - Application Specific | |
| Manufacturer | HARRIS | |
| Surface Mount | NO | |
| Number of Terminals | 28Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | HARRIS SEMICONDUCTOR | |
| Package Description | DIP, DIP28,.6 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XDIP-T28 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | MILITARY | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
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