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IBM25CPC710CF3B133 Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer IBM MICROELECTRONICS
Surface Mount YES
Number of Terminals 728Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer IBM MICROELECTRONICS
Part Package Code BGA
Package Description 35 MM, PLASTIC, FLIP CHIP, BGA-728
Clock Frequency-Max 133 MHz
Moisture Sensitivity Levels 1
Operating Temperature-Max 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA728,27X27,50
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 2.63 V
Supply Voltage-Min 2.38 V
Supply Voltage-Nom 2.5 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Pin Count 728
JESD-30 Code S-PBGA-B728
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCI
Seated Height-Max 3.45 mm
Address Bus Width 32
External Data Bus Width 64
Bus Compatibility POWERPC 740L; POWERPC 750L; POWERPC 750CX; POWERPC 74XX
Length 35 mm
Width 35 mm
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IBM25CPC710CF3B133 Documents

Download datasheets and manufacturer documentation for   IBM25CPC710CF3B133

  • Datasheets
IBM25CPC710CF3B133 brand manufacturers: IBM, Elecinsight stock, IBM25CPC710CF3B133 reference price.IBM. IBM25CPC710CF3B133 parameters, IBM25CPC710CF3B133 Datasheet PDF and pin diagram description download.You can use the IBM25CPC710CF3B133 Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find IBM25CPC710CF3B133 pin diagram and circuit diagram and usage method of function,IBM25CPC710CF3B133 electronics tutorials.You can download from the Elecinsight.