IBM25PPC750FX-GB2523T Tech Specifications

Category Embedded - Microprocessors
Manufacturer IBM MICROELECTRONICS
Surface Mount YES
Number of Terminals 292Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer IBM MICROELECTRONICS
Part Package Code BGA
Package Description 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
Supply Voltage-Nom 1.45 V
Supply Voltage-Min 1.4 V
Supply Voltage-Max 1.5 V
Package Style GRID ARRAY
Package Shape SQUARE
Package Equivalence Code BGA292,20X20,40
Package Code BGA
Package Body Material CERAMIC, METAL-SEALED COFIRED
Clock Frequency-Max 200 MHz
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code not_compliant
Pin Count 292
JESD-30 Code S-CBGA-B292
Qualification Status Not Qualified
Speed 800 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 3.087 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Width 21.02 mm
Length 21.02 mm
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IBM25PPC750FX-GB2523T Documents

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