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X25C02PM Tech Specifications

Category Memory
Manufacturer Micro Crystal
Surface Mount NO
Number of Terminals 8Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD
Part Package Code DIP
Package Description DIP, DIP8,.3
Clock Frequency-Max (fCLK) 1 MHz
Moisture Sensitivity Levels 3
Number of Words 256 wordsWord
Number of Words Code 256Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code 3A001.A.2.C
Terminal Finish TIN LEAD
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) 240
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.002 mA
Organization 256X8
Seated Height-Max 4.32 mm
Memory Width 8
Standby Current-Max 0.00015 A
Memory Density 2048 bit
Parallel/Serial SERIAL
Memory IC Type EEPROM
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Write Cycle Time-Max (tWC) 10 ms
Data Retention Time-Min 100
Write Protection HARDWARE/SOFTWARE
Length 10.03 mm
Width 7.62 mm
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X25C02PM Documents

Download datasheets and manufacturer documentation for   X25C02PM

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