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BGM 1033N7 E6327 Tech Specifications

Category RF Front End (LNA PA)
Manufacturer Infineon
Surface Mount YES
Number of Terminals 6Terminals
Package Bulk
Mfr PEI-Genesis
Product Status Active
Package Description 2.30 X 1.70 MM, 0.73 MM HEIGHT, ROHS COMPLIANT, TSNP-6
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Supply Voltage-Nom 2.7 V
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number BGM1033N7E6327
Package Code HVSON
Package Shape RECTANGULAR
Manufacturer Infineon Technologies AG
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Risk Rank 5.83
Series *
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.54 mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-N6
Temperature Grade INDUSTRIAL
Seated Height-Max 0.77 mm
Telecom IC Type TELECOM CIRCUIT
Width 1.7 mm
Length 2.3 mm
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BGM 1033N7 E6327 Documents

Download datasheets and manufacturer documentation for   BGM 1033N7 E6327

  • Datasheets
BGM 1033N7 E6327 brand manufacturers: Infineon, Elecinsight stock, BGM 1033N7 E6327 reference price.Infineon. BGM 1033N7 E6327 parameters, BGM 1033N7 E6327 Datasheet PDF and pin diagram description download.You can use the BGM 1033N7 E6327 RF Front End (LNA PA), DSP Datesheet PDF, find BGM 1033N7 E6327 pin diagram and circuit diagram and usage method of function,BGM 1033N7 E6327 electronics tutorials.You can download from the Elecinsight.