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- BGM1143N9E6327XUSA1
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BGM1143N9E6327XUSA1 Tech Specifications
Category | RF Front End (LNA PA) | |
Manufacturer | Infineon | |
EU RoHS | Compliant | |
Automotive | No | |
PPAP | No | |
Mounting | Surface Mount | |
Package Height | 0.75(Max) | |
Package Width | 1.1 | |
Package Length | 1.5 | |
PCB changed | 9 | |
Standard Package Name | TSNP | |
Supplier Package | TSNP | |
Category | Front-End Module |
Manufacturer Part Number | BGM1143N9E6327XUSA1 | |
Manufacturer | Infineon Technologies AG | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Risk Rank | 5.66 | |
Usage Level | Industrial grade | |
Operating Temperature | -40 to 85 °C | |
Part Status | Unconfirmed | |
HTS Code | 8542.39.00.01 | |
Reach Compliance Code | compliant | |
Pin Count | 9 | |
Screening Level | Industrial | |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
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BGM1143N9E6327XUSA1 Documents
Download datasheets and manufacturer documentation for BGM1143N9E6327XUSA1
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