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- CYW15G0403DXB-BGI
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CYW15G0403DXB-BGI Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | Infineon | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-BGA Exposed Pad | |
| Supplier Device Package | 256-L2BGA (27x27) | |
| Package | Tray | |
| Base Product Number | CYW15G0403 | |
| Mfr | Infineon Technologies |
| Product Status | Obsolete | |
| Operating Temperature | - | |
| Series | HOTlink II™ | |
| Voltage - Supply | 3.135V ~ 3.465V | |
| Function | - | |
| Interface | - | |
| Number of Circuits | 4Circuits | |
| Current - Supply | - |
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CYW15G0403DXB-BGI Documents
Download datasheets and manufacturer documentation for CYW15G0403DXB-BGI
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