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- BGA616H6327XTSA1
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BGA616H6327XTSA1 Tech Specifications
Category | RF Amplifiers | |
Manufacturer | Infineon | |
Factory Lead Time | 6 Weeks | |
Package / Case | SC-82A, SOT-343 | |
Mounting Type | Surface Mount | |
Mount | Surface Mount | |
Contact Plating | Tin | |
Number of Pins | 4Pins | |
Published | 2005 | |
Packaging | Tape & Reel (TR) | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Not For New Designs | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Max Operating Temperature | 150°C | |
Min Operating Temperature | -65°C | |
Max Power Dissipation | 360mW | |
Construction | COMPONENT |
Frequency | 0Hz~2.7GHz | |
Number of Channels | 1Channel | |
Max Supply Voltage | 4.5V | |
Test Frequency | 1GHz | |
Power Dissipation | 360mW | |
Halogen Free | Halogen Free | |
Gain | 19dB | |
RF/Microwave Device Type | WIDE BAND LOW POWER | |
RF Type | CDMA, GSM, PCS | |
Characteristic Impedance | 50Ohm | |
Noise Figure | 2.5dB | |
P1dB | 18dBm | |
Width | 1.25mm | |
Length | 2mm | |
Height | 900μm | |
RoHS Status | ROHS3 Compliant | |
Radiation Hardening | No | |
Lead Free | Lead Free |
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BGA616H6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA616H6327XTSA1
- DatasheetsBGA616
- PCN PackagingRecyclable Glass Carrier 14/Oct/2014 Reel Cover Tape Chg 16/Feb/2016
- Other Related DocumentsPart Number Guide
- Simulation ModelsInfineon-MMIC-LNA-AWR-MWO-Design-Kit-SM-v02_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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