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- BGA777N7E6327XTSA1
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BGA777N7E6327XTSA1 Tech Specifications
| Category | RF Amplifiers | |
| Manufacturer | Infineon | |
| Factory Lead Time | 4 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-XFDFN Exposed Pad | |
| Number of Pins | 7Pins | |
| Packaging | Tape & Reel (TR) | |
| Published | 2013 | |
| JESD-609 Code | e3 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -30°C | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 2.6V~3V | |
| Terminal Position | DUAL |
| Number of Functions | 1Function | |
| Supply Voltage | 2.8V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 2.3GHz~2.7GHz | |
| JESD-30 Code | R-PDSO-N6 | |
| Temperature Grade | OTHER | |
| Test Frequency | 2.3GHz~2.7MHz | |
| Operating Supply Current | 4.2mA | |
| Halogen Free | Halogen Free | |
| Gain | 16dB | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| RF Type | UMTS | |
| Noise Figure | 1.2dB | |
| Length | 2mm | |
| Height Seated (Max) | 0.4mm | |
| Width | 1.3mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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BGA777N7E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA777N7E6327XTSA1
- DatasheetsBGA777N7
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019 Recyclable Glass Carrier 14/Oct/2014
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLMult Dev EOL 24/Apr/2019
- Simulation ModelsInfineon-MMIC-LNA-AWR-MWO-Design-Kit-SM-v02_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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