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- BGA7M1N6E6327XTSA1
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BGA7M1N6E6327XTSA1 Tech Specifications
Category | RF Amplifiers | |
Manufacturer | Infineon | |
Factory Lead Time | 12 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 6-XFDFN | |
Usage Level | Industrial grade | |
Packaging | Tape & Reel (TR) | |
Published | 2014 | |
JESD-609 Code | e3 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 6Terminations | |
Terminal Finish | Tin (Sn) | |
Max Operating Temperature | 85°C | |
Min Operating Temperature | -40°C | |
HTS Code | 8542.39.00.01 | |
Max Power Dissipation | 60mW | |
Voltage - Supply | 1.5V~3.3V | |
Terminal Position | DUAL | |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Number of Functions | 1Function | |
Supply Voltage | 1.8V | |
Terminal Pitch | 0.4mm | |
Frequency | 1.8GHz~2.2GHz | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
JESD-30 Code | R-PDSO-N6 | |
Temperature Grade | INDUSTRIAL | |
Operating Supply Current | 4.4mA | |
Halogen Free | Halogen Free | |
Gain | 13dB | |
Telecom IC Type | TELECOM CIRCUIT | |
RF Type | LTE | |
Noise Figure | 0.6dB | |
P1dB | -7dBm | |
Length | 1.1mm | |
Height Seated (Max) | 0.4mm | |
Width | 0.7mm | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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BGA7M1N6E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA7M1N6E6327XTSA1
- DatasheetsBGA7M1N6
- Other Related DocumentsPart Number Guide
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Simulation ModelsInfineon-BGA7M1N6-AWR-MWO Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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