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BGB741L7ESDE6327XTSA1 Tech Specifications

Category RF Amplifiers
Manufacturer Infineon
Factory Lead Time 8 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-XFDFN Exposed Pad
Number of Pins 6Pins
Usage Level Military grade
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Gold (Au)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Max Power Dissipation 120mW
Voltage - Supply 1.8V~4V
Construction COMPONENT
Frequency 50MHz~3.5GHz
Test Frequency 1.5GHz
Current - Supply 30mA
Halogen Free Halogen Free
Gain 19.5dB
RF/Microwave Device Type WIDE BAND LOW POWER
RF Type Cellular, RKE, WiFi
Input Power-Max (CW) 20dBm
Characteristic Impedance 50Ohm
Max Junction Temperature (Tj) 150°C
Noise Figure 1dB
P1dB -6.5dBm
Height 500μm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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BGB741L7ESDE6327XTSA1 Documents

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