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- BGS15GA14E6327XTSA1
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BGS15GA14E6327XTSA1 Tech Specifications
Category | RF Switches | |
Manufacturer | Infineon | |
Factory Lead Time | 6 Weeks | |
Package / Case | 14-UFQFN Exposed Pad | |
Surface Mount | YES | |
Operating Temperature | -30°C~85°C | |
Packaging | Tape & Reel (TR) | |
Published | 2016 | |
JESD-609 Code | e4 | |
Pbfree Code | yes | |
Part Status | Obsolete | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 14Terminations | |
Terminal Finish | Gold/Nickel (Au/Ni) | |
HTS Code | 8542.39.00.01 | |
Voltage - Supply | 3V | |
Terminal Position | QUAD |
Terminal Form | BUTT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Number of Functions | 1Function | |
Supply Voltage | 3V | |
Frequency | 6GHz | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
JESD-30 Code | S-XQMA-B14 | |
Circuit | SP5T | |
Impedance | 50Ohm | |
Frequency Range | 100MHz~6GHz | |
Insertion Loss | 0.65dB | |
Telecom IC Type | TELECOM CIRCUIT | |
Isolation | 27dB | |
Length | 2mm | |
Height Seated (Max) | 0.65mm | |
Width | 2mm | |
RoHS Status | Non-RoHS Compliant |
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BGS15GA14E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGS15GA14E6327XTSA1
- DatasheetsBGS15GA14
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLMult Dev EOL-REV 6/Sep/2019 Mult Dev EOL 4/Sep/2019
- ConflictMineralStatementInfineon-company-51.pdf
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