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CY8C6336BZI-BLF03T Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Infineon
Mounting Type Surface Mount
Package / Case 116-WFBGA
Supplier Device Package 116-BGA (5.2x6.4)
RoHS Details
Moisture Sensitive Yes
Factory Pack QuantityFactory Pack Quantity 3500
Number of I/Os 78I/Os
Package Tape & Reel (TR)
Mfr Infineon Technologies
Data Converters A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Product Status Active
Packaging Reel
Operating Temperature -40°C ~ 85°C (TA)
Series PSoC® 6 BLE
Oscillator Type External, Internal
Speed 150MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
Core Processor ARM® Cortex®-M4F
Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB (512K x 8)
Connectivity FIFO, I²C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
EEPROM Size -
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CY8C6336BZI-BLF03T Documents

Download datasheets and manufacturer documentation for   CY8C6336BZI-BLF03T

  • Datasheets
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