CYW20735KFBG Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer Infineon
Package / Case QFN-60
Mounting Type Surface Mount
Supplier Device Package 111-FBGA (9x9)
Factory Pack QuantityFactory Pack Quantity 2600
Number of I/Os 40 I/OI/O
Moisture Sensitive Yes
Minimum Operating Temperature 0 C
Interface Type I2C, SPI, UART
Data RAM Type RAM
Mounting Styles SMD/SMT
Maximum Operating Temperature + 70 C
Supply Voltage-Min 3 V
Maximum Clock Frequency 48 MHz
Data RAM Size 384 kB
Core ARM Cortex M4
RoHS Details
Package Tray
Base Product Number CYW20735
Mfr Infineon Technologies
Product Status Active
Supply Voltage-Max 3.6 V
Series CYW20735
Packaging Tray
Operating Temperature -30°C ~ 85°C
Type TxRx + MCU
Voltage - Supply 3.3V
Frequency 2.4GHz
Operating Frequency 2.4 GHz
Operating Supply Voltage 3 V to 3.6 V
Memory Size -
Program Memory Type ROM
Program Memory Size 2 MB
Output Power 10 dBm
Data Bus Width 32 bit
Protocol Bluetooth v4.2
Power - Output 10dBm
RF Family/Standard Bluetooth
Sensitivity -94.5dBm
Data Rate (Max) 2Mbps
Number of ADC Channels 28 ChannelADC Channel
Serial Interfaces I²C, I²S, SPI, UART
Current - Receiving 8mA
Current - Transmitting 18mA
Number of Timers 6 TimerTimer
Modulation GFSK
GPIO 111
ADC Resolution 10 bit, 13 bit
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CYW20735KFBG Documents

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