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709359L7BFI Tech Specifications

Category Memory
Manufacturer IDT
Surface Mount YES
Number of Terminals 100Terminals
Package Description FPBGA-100
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Moisture Sensitivity Levels 3
Number of Words Code 8000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA100,10X10,32
Manufacturer Package Code BF100
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 18 ns
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number 709359L7BFI
Number of Words 8192 wordsWord
Supply Voltage-Nom (Vsup) 5 V
Package Code LFBGA
Package Shape SQUARE
Manufacturer Integrated Device Technology Inc
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Risk Rank 5.91
Part Package Code CABGA
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code not_compliant
Pin Count 100
JESD-30 Code S-PBGA-B100
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Power Supplies 5 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 4.5 V
Number of Ports 2Ports
Operating Mode SYNCHRONOUS
Supply Current-Max 0.44 mA
Organization 8KX18
Output Characteristics 3-STATE
Seated Height-Max 1.5 mm
Memory Width 18
Standby Current-Max 0.003 A
Memory Density 147456 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type DUAL-PORT SRAM
Standby Voltage-Min 4.5 V
Width 10 mm
Length 10 mm
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