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- 79RC32H434-300BCG
Integrated Device Technology (IDT) 79RC32H434-300BCG Embedded Microprocessors
256Terminations
IN STOCK
Min. : 1
Mult. : 1
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79RC32H434-300BCG Tech Specifications
| Category | Embedded - Microprocessors | |
| Manufacturer | IDT | |
| Surface Mount | YES | |
| Number of Pins | 256Pins | |
| Frequency(Max) | 300MHz | |
| Published | 1999 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Discontinued | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 256Terminations | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 70°C | |
| Min Operating Temperature | 0°C | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 1.2V |
| Frequency | 300MHz | |
| Pin Count | 256 | |
| Temperature Grade | COMMERCIAL | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Data Bus Width | 32b | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Number of Cores | 1Core | |
| Length | 17mm | |
| Width | 17mm | |
| Thickness | 1.4mm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
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79RC32H434-300BCG Documents
Download datasheets and manufacturer documentation for 79RC32H434-300BCG
- Datasheets79rc32h434-300bcg-JxnQhVEO-3jdbN3JqB.pdf
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