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10AS032E3F29E2LG Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Factory Lead Time 8 Weeks
Package / Case 780-BBGA, FCBGA
Surface Mount YES
Number of I/Os 360I/Os
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780Terminations
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B780
Number of Outputs 360Outputs
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 0.93V
Power Supplies 0.9V
Supply Voltage-Min (Vsup) 0.87V
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 360Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 320K Logic Elements
Number of Logic Cells 320000Logic Cells
Length 29mm
Height Seated (Max) 3.35mm
Width 29mm
RoHS Status RoHS Compliant
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