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5ASXBB3D4F35C4N Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Factory Lead Time 26 Weeks
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Number of I/Os MCU - 208, FPGA - 385I/O
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Arria V SX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number 5ASXBB3
JESD-30 Code S-PBGA-B1152
Supply Voltage-Max (Vsup) 1.13V
Supply Voltage-Min (Vsup) 1.07V
Speed 925MHz
RAM Size 64KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Clock Frequency 670MHz
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 350K Logic Elements
Length 35mm
Height Seated (Max) 2.7mm
Width 35mm
RoHS Status RoHS Compliant
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