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5ASXMB3E4F31I3N Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Factory Lead Time 8 Weeks
Package / Case 896-BBGA, FCBGA
Surface Mount YES
Number of I/Os MCU - 208, FPGA - 250I/O
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria V SX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896Terminations
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.15V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number 5ASXMB3
JESD-30 Code S-PBGA-B896
Supply Voltage-Max (Vsup) 1.18V
Supply Voltage-Min (Vsup) 1.12V
Speed 800MHz
RAM Size 64KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Clock Frequency 670MHz
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 350K Logic Elements
Length 31mm
Height Seated (Max) 2.7mm
Width 31mm
RoHS Status RoHS Compliant
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