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5CSEBA2U23A7N Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Factory Lead Time 8 Weeks
Package / Case 672-FBGA
Surface Mount YES
Number of I/Os MCU - 181, FPGA - 145I/O
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Automotive, AEC-Q100, Cyclone® V SE
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 672Terminations
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B672
Number of Outputs 145Outputs
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.13V
Power Supplies 1.11.2/3.32.5V
Supply Voltage-Min (Vsup) 1.07V
Speed 700MHz
RAM Size 64KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 145Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Elements
Number of Logic Cells 25000Logic Cells
Length 23mm
Height Seated (Max) 1.85mm
Width 23mm
RoHS Status RoHS Compliant
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