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- AGFA008R16A2E2V
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AGFA008R16A2E2V Tech Specifications
| Category | Embedded - System On Chip (SoC) | |
| Manufacturer | Intel | |
| Mounting Type | Free Hanging (In-Line) | |
| Package / Case | - | |
| Mounting Feature | - | |
| Shell Material | Aluminum | |
| Supplier Device Package | - | |
| Insert Material | - | |
| Backshell Material, Plating | - | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| Product Status | Active | |
| Mfr | Amphenol Aerospace Operations | |
| Base Product Number | MS27467E25B | |
| Primary Material | Metal | |
| Package | Bulk | |
| Voltage, Rating | - | |
| Number of I/Os | 384I/Os | |
| Series | Military, MIL-DTL-38999 Series I, LJT | |
| Operating Temperature | -65°C ~ 175°C | |
| Termination | Crimp | |
| Connector Type | Plug, Male Pins | |
| Number of Positions | 19Positions |
| Color | Olive Drab | |
| Applications | Aviation, Military | |
| Fastening Type | Bayonet Lock | |
| Current Rating (Amps) | - | |
| Orientation | A | |
| Shielding | Shielded | |
| Ingress Protection | Environment Resistant | |
| Shell Finish | Olive Drab Cadmium over Nickel | |
| Shell Size - Insert | 25-19 | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Shell Size, MIL | - | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Cable Opening | - | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 764K Logic Elements | |
| Flash Size | - | |
| Features | Coupling Nut | |
| Contact Finish Thickness - Mating | 50.0µin (1.27µm) | |
| Material Flammability Rating | - |
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