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AGFA027R25A1E1V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Mounting Type Surface Mount
Package / Case DO-214AB, SMC
Supplier Device Package DO-214AB (SMCJ)
Package Tape & Reel (TR)
Mfr MDE Semiconductor Inc
Product Status Active
Number of I/Os 624I/Os
Operating Temperature -55°C ~ 150°C (TJ)
Series 5.0SMDJ
Type Zener
Applications General Purpose
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Power Line Protection No
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Voltage - Breakdown (Min) 86.7V
Power - Peak Pulse 5000W (5kW)
Current - Peak Pulse (10/1000μs) 39.7A
Voltage - Clamping (Max) @ Ipp 126V
Architecture MPU, FPGA
Voltage - Reverse Standoff (Typ) 78V
Bidirectional Channels 1
Capacitance @ Frequency -
Primary Attributes FPGA - 2.7M Logic Elements
Flash Size -
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