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AGFB006R16A2E2V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Mounting Type Surface Mount
Package / Case 4-XDFN Exposed Pad
Supplier Device Package 4-HXSON (1x1)
Package Tape & Reel (TR)
Base Product Number LD683
Mfr NXP USA Inc.
Product Status Obsolete
Number of I/Os 384I/Os
Operating Temperature -40°C ~ 85°C
Series -
Voltage - Input (Max) 5.5V
Output Type Fixed
Speed 1.4GHz
Output Configuration Positive
RAM Size 256KB
Current - Output 300mA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Control Features Enable
Voltage - Output (Min/Fixed) 2.2V
Number of Regulators 1Regulator
Architecture MPU, FPGA
Protection Features Over Current, Over Temperature, Soft Start
Current - Quiescent (Iq) 75 µA
Voltage Dropout (Max) 0.24V @ 300mA (Typ)
PSRR 75dB (1kHz)
Voltage - Output (Max) -
Primary Attributes FPGA - 573K Logic Elements
Flash Size -
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