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- AGFB008R16A2E3E
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AGFB008R16A2E3E Tech Specifications
| Category | Embedded - System On Chip (SoC) | |
| Manufacturer | Intel | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 | |
| Package | Tape & Reel (TR) | |
| Base Product Number | RS73G2A | |
| Mfr | KOA Speer Electronics, Inc. | |
| Product Status | Active | |
| Number of I/Os | 384I/Os | |
| Operating Temperature | -55°C ~ 155°C | |
| Series | RS73 | |
| Size / Dimension | 0.079 L x 0.049 W (2.00mm x 1.25mm) | |
| Tolerance | ±1% | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C |
| Resistance | 4.22 MOhms | |
| Composition | Thick Film | |
| Power (Watts) | 0.25W, 1/4W | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 764K Logic Elements | |
| Flash Size | - | |
| Features | Automotive AEC-Q200, Moisture Resistant | |
| Height Seated (Max) | 0.024 (0.60mm) | |
| Ratings | AEC-Q200 |
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