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AGFB012R24B2E3V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Mounting Type Panel Mount, Through Hole
Package / Case -
Mounting Feature -
Shell Material Stainless Steel
Supplier Device Package -
Insert Material Fluorosilicone Elastomer
Backshell Material, Plating -
Voltage, Rating 600VAC, 850VDC
Package Bulk
Primary Material Metal
Base Product Number D38999/25HE
Mfr TE Connectivity Deutsch Connectors
Product Status Active
Contact Materials Nickel Iron Alloy
Contact Finish Mating Gold
Number of I/Os 768I/Os
Operating Temperature -65°C ~ 200°C
Series MIL-DTL-38999 Series III, DTS
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 23Positions
Color Silver
Applications Aviation, Communication Systems, Industrial
Fastening Type Threaded
Current Rating (Amps) -
Orientation D
Shielding Shielded
Ingress Protection Environment Resistant
Shell Finish Electroless Nickel
Shell Size - Insert 17-99
Speed 1.4GHz
RAM Size 256KB
Shell Size, MIL -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Cable Opening -
Architecture MPU, FPGA
Primary Attributes FPGA - 1.2M Logic Elements
Flash Size -
Features Hermetically Sealed
Contact Finish Thickness - Mating -
Material Flammability Rating -
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