AGFB014R24B2E3V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Package / Case Cell (36)
Supplier Device Package -
Package Box
Base Product Number TPS-12
Mfr Tycon Systems Inc.
Product Status Active
Current Short Circuit (Isc) 2.19 A
Number of I/Os 768I/Os
Operating Temperature -40°C ~ 85°C
Series -
Size / Dimension 21.457 L x 19.291 W x 1.378 H (545.00mm x 490.00mm x 35.00mm)
Type Monocrystalline
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 1.4M Logic Elements
Flash Size -
Voltage @ Pmpp 16.92 V
Power (Watts) - Max 35 W
Current @ Pmpp 2.07 A
Voltage - Open Circuit 20.87 V
Select at least one checkbox above to show similar products in this category.
View Similar
AGFB014R24B2E3V brand manufacturers: Intel, Elecinsight stock, AGFB014R24B2E3V reference price.Intel. AGFB014R24B2E3V parameters, AGFB014R24B2E3V Datasheet PDF and pin diagram description download.You can use the AGFB014R24B2E3V Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB014R24B2E3V pin diagram and circuit diagram and usage method of function,AGFB014R24B2E3V electronics tutorials.You can download from the Elecinsight.