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AGFB014R24C2I3V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Contact Plating Tin
Mount Through Hole
Package / Case -
Supplier Device Package -
Voltage Rating (DC) 200 V
RoHS Compliant
Number of I/Os 744I/Os
Package Tray
Mfr Intel
Product Status Active
Packaging Bulk
Operating Temperature -40°C ~ 100°C (TJ)
Series Agilex F
Tolerance 20 %
Termination Radial
Max Operating Temperature 105 °C
Min Operating Temperature -40 °C
Capacitance 47 µF
Lead Pitch 7.5 mm
ESR (Equivalent Series Resistance) 4 Ω
Lead Diameter 800 µm
Ripple Current 210 mA
Life (Hours) 3000 hours
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 1.4M Logic Elements
Flash Size -
Diameter 16 mm
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