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AGFB014R24D1E3V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)
Series Agilex F
Packaging Tray
Operating Temperature 0°C ~ 100°C (TJ)
Part Status Active
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 1.4M Logic Elements
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