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AGFB027R31C2E1V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Package / Case -
Supplier Device Package -
Package Bag
Base Product Number DL66G12
Mfr TE Connectivity Deutsch Connectors
Product Status Active
Number of I/Os 720I/Os
Series *
Operating Temperature 0°C ~ 100°C (TJ)
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.7M Logic Elements
Flash Size -
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