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AGIB019R18A2I3E Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Package / Case 1805-BBGA Exposed Pad
Supplier Device Package 1805-BGA (42.5x42.5)
Number of I/Os 480I/Os
Series Agilex I
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
Part Status Active
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 1.9M Logic Elements
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