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AGIB023R18A2E3V Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Intel
Mount Through Hole
Package / Case -
Supplier Device Package -
RoHS Non-Compliant
Number of I/Os 480I/Os
Package Tray
Mfr Intel
Product Status Active
Operating Temperature 0°C ~ 100°C (TJ)
Series Agilex I
Termination Solder
Number of Rows 1Row
Pitch 6.35 mm
Orientation Right Angle
Number of Contacts 18Contacts
Housing Color Black
ELV Compliant
Number of Circuits 18Circuits
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.3M Logic Elements
Flash Size -
Flammability Rating UL94 V-0
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