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- BD82H77 S LJ88
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BD82H77 S LJ88 Tech Specifications
Category | Specialized ICs | |
Manufacturer | Intel | |
Mounting Type | Panel Mount, Through Hole | |
Surface Mount | YES | |
Mounting Feature | Flange | |
Shell Material | Aluminum | |
Number of Terminals | 942Terminals | |
Package | Retail Package | |
Primary Material | Metal | |
Mfr | Glenair | |
Product Status | Active | |
Contact Materials | Copper Alloy | |
Contact Finish Mating | Gold | |
Package Style | GRID ARRAY | |
Package Body Material | PLASTIC | |
Package Equivalence Code | BGA942(UNSPEC) | |
Rohs Code | Yes | |
Manufacturer Part Number | BD82H77/SLJ88 | |
Package Code | BGA | |
Manufacturer | Intel Corporation |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Risk Rank | 5.84 | |
Operating Temperature | -65°C ~ 175°C | |
Series | 806 | |
Termination | Solder | |
Connector Type | Plug, Male Pins | |
Color | Olive Drab | |
Fastening Type | Threaded | |
Subcategory | Bus Controllers | |
Terminal Position | BOTTOM | |
Orientation | D | |
Terminal Form | BALL | |
Reach Compliance Code | unknown | |
Shell Finish | Olive Drab Cadmium | |
Shell Size - Insert | 20-97 | |
Qualification Status | Not Qualified | |
Power Supplies | 1.05,1.5,1.8,3.3,5 V | |
Features | Ground |
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