EP3C25F324C8N Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Intel
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Number of I/Os 215I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® III
Published 2009
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324Terminations
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP3C25
JESD-30 Code R-PBGA-B324
Number of Outputs 215Outputs
Qualification Status Not Qualified
Clock Frequency 472.5MHz
Number of Inputs 215Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24624Logic Elements/Cells
Total RAM Bits 608256
Number of LABs/CLBs 1539LABs/CLBs
Length 19mm
Height Seated (Max) 2.2mm
Width 19mm
RoHS Status RoHS Compliant
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