EP3C25F324I7N Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Intel
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Number of I/Os 215I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Cyclone® III
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324Terminations
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP3C25
JESD-30 Code R-PBGA-B324
Number of Outputs 215Outputs
Qualification Status Not Qualified
Clock Frequency 472.5MHz
Number of Inputs 215Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24624Logic Elements/Cells
Total RAM Bits 608256
Number of LABs/CLBs 1539LABs/CLBs
Length 19mm
Height Seated (Max) 2.2mm
Width 19mm
RoHS Status RoHS Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

EP3C25F324I7N Documents

Download datasheets and manufacturer documentation for   EP3C25F324I7N

EP3C25F324I7N brand manufacturers: Intel, Elecinsight stock, EP3C25F324I7N reference price.Intel. EP3C25F324I7N parameters, EP3C25F324I7N Datasheet PDF and pin diagram description download.You can use the EP3C25F324I7N Embedded - FPGAs (Field Programmable Gate Array), DSP Datesheet PDF, find EP3C25F324I7N pin diagram and circuit diagram and usage method of function,EP3C25F324I7N electronics tutorials.You can download from the Elecinsight.